Product description
This is the low melt solder paste that we use. It melts at 138C. You won’t need it very often, so one vial of these and you should be set for a while. This stuff allows you to remove components and connectors without using the super high heat required to melt lead-free solder. Just dab a little bit of this stuff on the logic board, then use your soldering iron to mix the lead-free solder with the low melt solder paste, then use your microtweezers or your hot air rework station at around 225C to remove the connector/component.
Contains 20g of low melt solder paste!
